- Low viscosity, low oil release rate;excellent electrical insulation
- Addition type platinum vulcanization system
- Used in materials such as thermal silica gel, insulation, sealing potting, filling, etc.
CX-3901 Addition Molding Silicone Gel
Description
This product is a one-component MQ silicone resin gel with soft texture, low hardness, no curing, and good thermal conductivity, compression, rheology and electrical properties. It can be used directly, the operation is simple, and the economy and time cost are reduced. Applied to various gaps and between electronic components that require low mechanical pressure, the force on the device interface can be minimized, or even free.
FEATURES
- Crystal clear gel
- Soft texture, low hardness
- Excellent elasticity and compression properties
- Excellent thermal conductivity
- Excellent rheology, adhesion and sealing properties
- Good flame retardancy and electrical insulation properties
BENEFITS
- Good fluidity, simple operation, easy to dispense
- Easy to deepen curing, small reaction force to the device
- It has excellent electrical properties, aging resistance, and resistance to alternating cold and heat
- Safe and environmentally friendly, no pollution
PARAMETER | UNIT | VALUE |
Appearance | Transparent liquid | |
Specific Gravity |
g/cm3 |
0.98 |
Viscosity(25°C) | mm2/s | ≤1500 |
Operating time(30°C) | hr | 4~240 |
Curing time(120°C) | min | 10~15 |
Storage time(0-8°C) | month | 6 |
Refractive index | nD25 | 1.44 |
Penetration | 0.1mm | 100±5 |
Dielectric content | 1kHz | 2.8 |
Dielectric strength | kV/mm | 23 |
Volume resistivity | Ω·cm | 1015 |
Thermal conductivity | W/m·k | 0.20 |
Flame retardant | UL 94HB |
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