CX-3901 Addition Molding Silicone Gel

  • Low viscosity, low oil release rate;excellent electrical insulation
  • Addition type platinum vulcanization system
  • Used in materials such as thermal silica gel, insulation, sealing potting, filling, etc.
Category:

Description

This product is a one-component MQ silicone resin gel with soft texture, low hardness, no curing, and good thermal conductivity, compression, rheology and electrical properties. It can be used directly, the operation is simple, and the economy and time cost are reduced. Applied to various gaps and between electronic components that require low mechanical pressure, the force on the device interface can be minimized, or even free.

FEATURES

  • Crystal clear gel
  • Soft texture, low hardness
  • Excellent elasticity and compression properties
  • Excellent thermal conductivity
  • Excellent rheology, adhesion and sealing properties
  • Good flame retardancy and electrical insulation properties

BENEFITS

  • Good fluidity, simple operation, easy to dispense
  • Easy to deepen curing, small reaction force to the device
  • It has excellent electrical properties, aging resistance, and resistance to alternating cold and heat
  • Safe and environmentally friendly, no pollution
PARAMETER UNIT VALUE
Appearance   Transparent liquid
Specific Gravity

g/cm3

0.98
Viscosity(25°C) mm2/s ≤1500
Operating time(30°C) hr 4~240
Curing time(120°C) min 10~15
Storage time(0-8°C) month 6
Refractive index nD25 1.44
Penetration  0.1mm 100±5
Dielectric content 1kHz 2.8
Dielectric strength kV/mm 23
Volume resistivity Ω·cm 1015
Thermal conductivity W/m·k 0.20
Flame retardant   UL 94HB

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