- Good internal viscosity and superior mechanical damping performance
- Fast heat curing
- Used in materials such as thermal silica gel, insulation, sealing potting, filling, etc..
CX-3633AB MQ Silicone Thermal Conductive Gel
Description
This product is a two-component addition molding room temperature curing MQ silicone resin thermal conductive gel, which can be heated to accelerate vulcanization (maximum temperature 150 ℃), low viscosity, low oil release rate and excellent adhesion. It is used to potting various automobiles, power electronic components, solar cells and other damping products. Products with different hardness can be obtained by adjusting the distribution ratio of group A and group B.
FEATURES
- Crystal transparent gel-like, low hardness, excellent elasticity
- Low viscosity, low oil release rate
- Two-component, 1: 1 mixing ratio
- Good internal viscosity and superior mechanical damping performance
- Excellent flame retardancy
- Excellent electrical insulation
BENEFITS
- Good liquidity and simple operation
- Fast heat curing
- Safe and environmentally friendly, no pollution
- Addition type platinum vulcanization system
| PARAMETER | UNIT | VALUE |
|
| CX-3633AB | CX-3638AB | ||
| Appearance | Colorless transparent liquid | Colorless transparent liquid | |
| Viscosity | mm²/s | A=800±50 B=800±50 |
A=800±50 B=800±50 |
| Specific gravity | g/cm³ | 0.95-0.98 | 0.95-0.98 |
| Operating time(25°C） | hr | ≥7 | ≥7 |
|
Curing time(125°C） |
min |
≤20 |
≤20 |
| The components of the platinum catalyst | A | A | |
| After Curing | |||
| Refractive Index | nD25 | 1.45 | 1.45 |
| Penetration | 0.1mm | 100±10 | 115±10 |
| Thermal expansion coefficient | m/mk | 1E-04 | 1E-04 |
| Dielectric content | 1kHz | 2.7 | 2.7 |
| Dielectric Strength | kV/mm | 23 | 23 |
| Volume Resistivity | Ω·cm | 1*1015 | 1*1015 |
| Thermal Conductivity | W/mk | 0.2 | 0.2 |
| Low molecular content | ppm | <500 | <500 |
| Flame retardant | UL 94HB | UL 94HB | |
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