- Low viscosity, low oil release rate
- Excellent high and low temperature resistance
- It is used in thermal conductive silica gel, electronic product insulation, sealing potting, filling and other materials.
CX-3206AB Silicone Resin Thermal Conductive
Description
This product is a two-component addition molding and curing thermally conductive gel formulated with methyl vinyl silicone resin, which can be heated to accelerate vulcanization, has low viscosity, low oil release rate and excellent adhesion. It is used to potting various automobiles, power electronic components, solar cells and other damping products.
FEATURES
- Low viscosity, low oil release rate
- Excellent electrical insulation
- Addition type platinum vulcanization system
- Two-component, 1: 1 mixing ratio
- Crystal transparent gel, excellent fluidity
BENEFITS
- Convenient production and use, simple operation
- Safe and environmentally friendly, no pollution
- Excellent high and low temperature resistance
- Fast heat curing
| PARAMETER | UNIT | VALUE |
||
| CX-3206AB | CX-3208AB | |||
| Appearance | Colorless transparent liquid | Colorless transparent liquid | ||
| Viscosity | mm²/s | A=800±50 B=800±50 | A=800±50 B=800±50 |
|
| Specific gravity | g/cm³ | 0.96±0.01 | 0.96±0.01 | |
| Operating time(25°C） | hr | ≥7 | ≥7 | |
| Curing time(125°C） | min | ≤20 | ≤20 | |
| The components of the platinum catalyst | A | A | ||
| After Curing | ||||
| Refractive Index | nD25 | 1.40 | 1.40 | |
| Penetration | 0.1mm | 45±5 | 60±5 | |
| Elongation | % | NA | NA | |
| Dielectric conetnt | 1kHz | NA | NA | |
| Dielectric Strength | kV/mm | 23 | 23 | |
| Volume Resistivity | Ω·cm | 1.1*1015 | 1.1*1015 | |
| Thermal conductivity | W/m·K | 0.2 | 0.2 | |
| Low molecular content ∑D3~D10 | ppm | <500 | <500 | |
| Flame retardant | UL 94HB | UL 94HB | ||
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