- Good substrate adhesion
- Excellent mechanical properties and weather resistance
- Used in thermal gel dispensing, 5G mobile phones, AI, AR and communication base stations, Internet of Things, new energy vehicles, LED drivers and other sealed fillings.
CX-3502AB Super Soft Thermal Conductive Gel
Description
This product is a two-component addition molding room temperature vulcanized silicone thermal conductive gel that can be processed in a variety of ways. The material is a two-component silicone resin material, which can be cured by the heat of the chip itself, or accelerated curing at a high temperature of 150°C. Realize the efficient heat dissipation of the chip, and play a good thermal management effect in intelligent electronic products such as integrated circuits (IC) and central processing units (CPU). The cured product can be used in the range of -60℃-200℃, and has the characteristics of moisture resistance, moisture resistance, water resistance, ozone resistance, radiation resistance, and aging resistance.
FEATURES
- Good substrate adhesion
- Excellent wettability and thixotropy
- Fast heat curing
- Low viscosity, low oil removal rate
- Excellent dielectric and electrical insulation properties
- No sag, slump or cracks will appear during thermal aging
BENEFITS
- Excellent high and low temperature resistance
- Excellent mechanical properties and weather resistance
- Large amount of powder, high thermal conductivity
- Reworkable, stripping without residue
- Easy to use and simple to operate
- Safe and environmentally friendly, no pollution
| PARAMETER | UNIT | VALUE |
| Appearance | Colorless transparent liquid | |
| Viscosity | mm²/s | A=1050±50 B=350±50 |
| Specific gravity | g/cm³ | 0.97 |
| Operating time(25°C） | min | ≥7 |
| Curing time(125°C） | min | ≤15 |
| The components of the platinum catalyst | A | |
| After Curing | ||
| Refractive Index | nD25 | 1.44 |
| Penetration 1/4cone | 0.1mm | 160±10 |
| Dielectric content | 1kHz | 2.5 |
| Dielectric Strength | kV/mm | 18 |
| Volume Resistivity | Ω·cm | 1.1*1015 |
| Low molecular content ∑D3~D12 | ppm | <500 |
| Loss factor | 1kHz | 1*10-4 |
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