- Low viscosity, low oil release rate
- Excellent high and low temperature resistance;fast heat curing
- Used in materials such as thermal silica gel, insulation, sealing potting, filling, etc.
CX-3212AB MQSilicone Resin Thermal Conductive
Description
This product is a two-component addition molding room temperature curing MQ silicone resin thermal conductive gel, which can be heated to accelerate vulcanization (maximum temperature 150 ℃), low viscosity, low oil release rate and excellent adhesion. Products with different hardness can be obtained by adjusting the distribution ratio of group A and group B.
FEATURES
- Crystal transparent gel, excellent fluidity
- Low viscosity, low oil release rate
- Two-component, 1: 1 mixing ratio
- Excellent flame retardancy
- Excellent electrical insulation
- Addition type platinum vulcanization system
BENEFITS
- Convenient production and use, simple operation
- Safe and environmentally friendly, no pollution
- Excellent high and low temperature resistance
- Fast heat curing
| PARAMETER | UNIT | VALUE |
||
| CX-3212AB | CX-3213AB | |||
| Appearance | Colorless transparent liquid | Colorless transparent liquid | ||
| Viscosity | mm²/s | A=800±50 B=800±50 | A=800±50 B=800±50 |
|
| Specific gravity | g/cm³ | 0.95-0.98 | 0.95-0.98 | |
| Operating time(25°C） | hr | ≥7 | ≥7 | |
| Curing time(125°C） | min | 20 | 20 | |
| The components of the platinum catalyst | A | A | ||
| After Curing | ||||
| Refractive Index | nD25 | 1.41 | 1.41 | |
| Penetration | 0.1mm | 200±5 | 230±5 | |
| Dielectric content | 1kHz | 2.5 | 2.5 | |
| Dielectric Strength | kV/mm | 22 | 22 | |
| Volume Resistivity | Ω·cm | 1*1015 | 1*1015 | |
| Thermal conductivity | W/m·K | 0.2 | 0.2 | |
| Low molecular content ∑D3~D10 | ppm | <500 | <500 | |
| Flame retardant | UL 94HB | UL 94HB | ||
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