High Compression Resilience Silicone Gels for Thermal Interface Materials

With the decrease in size and increase in power of electronic device, the heat generated by these devices has increased, leading to a heightened risk of thermal management issues for electronic components. The unwanted heat has to be dissipated away from the components to maintain performance of the components or device. Therefore, the need for efficient transfer of heat has become a key design requirement. Firstly, it requires thermal conductive pads must be suitable for applications in electronic assemblies with low assembly stress. Secondly, it requires thermal conductive pads must have excellent compression resilience and low heat resistance to dissipate the huge heat.

In response to this challenge, as a leader in the field of electronic silicone, Trancy has successfully developed the high compression resilience and low stress silicone gel of CX – 3933AB, by adopting a unique low – modulus and high – resilience silicone resin formula. CX – 3933AB can be cured to form a soft elastomer, exhibiting strong physical strength. It maintains good mechanical strength and excellent compression resilience of over 20% after experiencing Thermal Aging, Thermal HAST and Thermal Cycling.

Key Features

• High elasticity ≥ 35%
• Maintain high compression resilience after thermal aging (at 125℃ for 7 days, resilience > 20%)
• Low oil-bleeding rate (oil diameter < 1mm)
• Excellent mechanical properties 
• Can be completely peeled off after Thermal Aging
• Good electrical insulation properties