- Good thixotropy, high adhesion
- Large amount of powder, high thermal conductivity
- Used in thermal conductive silicone gaskets, automotive power supplies, electronic component product insulation, solar cells and other damping products, etc
CX-3651AB Silicone Thermal Conductive Gel
Description
This product is an addition-molded silicone resin thermal conductive gel, which can be heated to accelerate vulcanization, has low viscosity and strong adhesion.No low molecules are released during curing, the cured product has a small shrinkage rate, non-corrosive, stable chemical properties, and has the characteristics of moisture resistance, water resistance, ozone resistance, radiation resistance, and aging resistance.
FEATURES
- Low viscosity, high filling rate
- Excellent liquidity
- Good thixotropy, high adhesion
- Excellent electrical insulation
- Two-component, 1: 1 mixing ratio
BENEFITS
- Large amount of powder, high thermal conductivity
- Convenient production and use, simple operation
- Excellent resistance to high and low temperature and high humidity
- Safe and environmentally friendly, no pollution
| PARAMETER | UNIT | VALUE |
| Appearance | Transparent liquid | |
| Specific Gravity |
g/cm3 |
0.97 |
| Viscosity(25°C） | mm2/s | A=200±20 B=200±20 |
| Operating time(25°C） | hr | ≥7 |
| Curing time(125°C） | min | ≤20 |
| The components of the platinum catalyst | A | |
| Refractive index | nD25 | 1.44 |
| Penetration | 0.1mm | 400±5 |
| Dielectric strength | kV/mm | 23 |
| Low molecular content | ppm | <500 |
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