- Low viscosity, low oil release rate;good thixotropy, high adhesion
- Large amount of powder, high thermal conductivity
- It is used in thermal conductive silicone sheet, automotive power supply, electronic component product insulation, solar battery and other damping products,etc.
CX-3554AB HK Thermal Gel
Description
This product is a low-molecular-weight addition-formed silicone thermal conductive gel, which can be heated to accelerate vulcanization, has low viscosity, low oil evolution and excellent adhesion characteristics. No low molecules are released during curing, the cured product has a small shrinkage rate, non-corrosive, stable chemical properties, and has the characteristics of moisture resistance, water resistance, ozone resistance, radiation resistance, and aging resistance.
FEATURES
- Good wettability and high filling rate
- Low viscosity, low oil separation rate
- Good thixotropy, high adhesion
- Crystal transparent gel, excellent fluidity
- Excellent electrical insulation
- Two-component, 1: 1 mixing ratio
BENEFITS
- Large amount of powder, high thermal conductivity
- Excellent high and low temperature resistance
- Convenient production and use, simple operation
- Fast heat curing
- Safe and environmentally friendly, no pollution
| PARAMETER | UNIT | VALUE |
| CX-3554AB | ||
| Appearance | Colorless transparent liquid | |
| Viscosity | mm²/s | A=380±30 B=270±30 |
| Specific gravity | g/cm³ | 0.97 |
| Operating time(25°C） | hr | ≥7 |
| Curing time(125°C） | min | ≤20 |
| The components of the platinum catalyst | A | |
| After Curing | ||
| Refractive Index | nD25 | 1.44 |
| Penetration | 0.1mm | 630±10 |
| Dielectric content | 1kHz | 2.8 |
| Dielectric Strength | kV/mm | 18 |
| Volume Resistivity | Ω·cm | 1.1*1015 |
| Thermal Conductivity | W/mk | 0.18 |
| Low molecular content | ppm | <500 |
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