- Excellent thixotropy, good fluidity, high adhesion
- Large amount of powder, high thermal conductivity
- It is used in thermal conductive silicone sheet, automotive power supply, electronic component product insulationand other damping products, etc
CX-3181AB LV Thermal Gel
Description
This product is an addition-molded silicone thermal conductive gel with very low viscosity, low molecular content and extremely low ion content, can be heated to accelerate vulcanization, low viscosity, and low oil separation rate. No low molecules are released during curing, the cured product has a small shrinkage rate, non-corrosive, stable chemical properties, and has the characteristics of moisture resistance, water resistance, ozone resistance, radiation resistance, and aging resistance.
FEATURES
- Good wettability and high filling rate
- Low viscosity, low oil separation rate
- Excellent thixotropy, good fluidity, high adhesion
- Excellent electrical insulation
- Safe and environmentally friendly, no pollution
- Two-component, 1: 1 mixing ratio
BENEFITS
- Large amount of powder, high thermal conductivity
- Excellent resistance to high and low temperature and high humidity
- Convenient production and use, simple operation
- Fast heat curing, low viscosity
| PARAMETER | UNIT | VALUE |
|
| Before Curing | |||
| Appearance | Colorless transparent oil | ||
| Viscosity | mm²/s | A=200±20 B=230±20 | |
| Operating time(25°C） | hr | ≥7 | |
| Curing time(125°C） | min | ≤20 | |
| The components of the platinum catalyst | A | ||
| After Curing | |||
| Refractive Index | nD25 | 1.44 | |
| Penetration 1/4 cone | 0.1mm | 120±10 | |
| Dielectric Strength | kV/mm | 18 | |
| Volume Resistivity | Ω·cm | 1*1015 | |
| Low molecular content ∑D3~D10 | ppm | <200 | |
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