CX-3063AB Potting Silicone Gel

  • Excellent heat resistance, cold resistance, light resistance
  • Fast heat curing, with moisture-proof, dust-proof, waterproof, shockproof and other functions.
  • Used in various electromechanical equipment, power supply module and circuit board protection, electronic component product potting and sealing filling, etc.
Category:

Description

This product is a two-component addition molding room temperature vulcanizing silicone potting and filling gel, which can be quickly vulcanized by heating, low viscosity, low oil release rate and excellent adhesion. No low molecules are released during curing, and the cured product has a small shrinkage rate, non-corrosive, and stable chemical properties.

FEATURES

  • Crystal transparent gel, excellent fluidity
  • Excellent heat resistance, cold resistance, light resistance
  • Very low low molecular content
  • Good thixotropy, high adhesion
  • Low viscosity, low oil removal rate
  • Soft elasticity, excellent electrical insulation performance, low shrinkage
  • Excellent resistance to media, ozone resistance, weather resistance, good aging resistance, etc.

BENEFITS

  • Fast heat curing, with moisture-proof, dust-proof, waterproof, shockproof and other functions.
  • Convenient production and use, simple operation
  • Two-component, 1: 1 mixing ratio
  • Safe and environmentally friendly, no pollution
PARAMETER UNIT VALUE
Before Curing
Appearance   Light yellow slightly turbid liquid
Specific Gravity g/cm³ 0.99
Viscosity mm²/s

A≤900 B≤600

Mixed viscosity mm²/s

800

Operating time min 240
Curing time h 23°C*24h
 After Curing
Penetration 1/4 cone 0.1 mm 60±5
Dielectric Content 50Hz 3.0
Volume Resistivity TΩ·cm 8.0
Insulation breakdown strength kV 22
Dielectric loss factor 50Hz 5*10-4
Thermal Conductivity W/m·K 0.2
Complex shear modulus 10Hz Pa 13,000
Low molecular content ∑D3~D12 ppm <100

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