- Excellent heat resistance, cold resistance, light resistance
- Fast heat curing, with moisture-proof, dust-proof, waterproof, shockproof and other functions.
- Used in various electromechanical equipment, power supply module and circuit board protection, electronic component product potting and sealing filling, etc.
CX-3063AB Potting Silicone Gel
Description
This product is a two-component addition molding room temperature vulcanizing silicone potting and filling gel, which can be quickly vulcanized by heating, low viscosity, low oil release rate and excellent adhesion. No low molecules are released during curing, and the cured product has a small shrinkage rate, non-corrosive, and stable chemical properties.
FEATURES
- Crystal transparent gel, excellent fluidity
- Excellent heat resistance, cold resistance, light resistance
- Very low low molecular content
- Good thixotropy, high adhesion
- Low viscosity, low oil removal rate
- Soft elasticity, excellent electrical insulation performance, low shrinkage
- Excellent resistance to media, ozone resistance, weather resistance, good aging resistance, etc.
BENEFITS
- Fast heat curing, with moisture-proof, dust-proof, waterproof, shockproof and other functions.
- Convenient production and use, simple operation
- Two-component, 1: 1 mixing ratio
- Safe and environmentally friendly, no pollution
| PARAMETER | UNIT | VALUE |
| Before Curing | ||
| Appearance | Light yellow slightly turbid liquid | |
| Specific Gravity | g/cm³ | 0.99 |
| Viscosity | mm²/s |
A≤900 B≤600 |
| Mixed viscosity | mm²/s |
800 |
| Operating time | min | 240 |
| Curing time | h | 23°C*24h |
| After Curing | ||
| Penetration 1/4 cone | 0.1 mm | 60±5 |
| Dielectric Content | 50Hz | 3.0 |
| Volume Resistivity | TΩ·cm | 8.0 |
| Insulation breakdown strength | kV | 22 |
| Dielectric loss factor | 50Hz | 5*10-4 |
| Thermal Conductivity | W/m·K | 0.2 |
| Complex shear modulus | 10Hz Pa | 13,000 |
| Low molecular content ∑D3~D12 | ppm | <100 |
Reviews
There are no reviews yet.